Aluminum Copper Silicon (AlSiCu) Sputtering Target
Composition: AlSiCu
Catalog No.DPSI1329ST
Purity:99.9%
- Product Details
Aluminum Copper Silicon (AlSiCu) sputtering target specifications
Formula: AlSiCu
CAS No.: N.A.
Max. dia. of flat disc sputter target: 14"
Typical lead time of AlSiCu sputtering target: 4 weeks
Regular Dimensions and Price of Aluminum Copper Silicon (AlSiCu) Sputtering Target
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Product Name |
Reference Price |
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2"dia
x 1/8"t Aluminum Copper Silicon sputtering target |
600 | Add to Chart |
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3"dia
x 1/8"t Aluminum Copper Silicon sputtering target |
720 |
Add to Chart |
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2"dia
x 1/8"t AlSiCu sputtering target with In bonding to Cu bck plt |
$650 |
Add to Chart |
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3"dia
x 1/8"t AlSiCu sputtering target with In bonding to Cu bck plt |
$840 | Add to Chart |
About Our Sputtering Target
QSAM is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Alloys sputter targets
Sputtering Aluminum Copper Silicon
Sputtering technique are frequently used to create a thin film of Aluminum Copper Silicon. The AlSiCu target material is placed on the electrode in the sputtering chamber. Heavy ion particle or laser are frequently used to ejecting coating material from the target, made by Aluminum Copper Silicon in this case, to create a thin film of AlSiCu on the surface of the substrate.
Aluminum Copper Silicon Sputtering Target Packaging
QSAMs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA
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