Aluminum Copper (Al/Cu) Sputtering Targets
Composition: Aluminum and Copper
Catalog No.DPMA13ST
Purity:99.9% ~ 99.999%Please click 
for discount and other size
- Product Details
Aluminum Copper (Al/Cu) sputtering target specifications
Formula: Al/Cu
CAS No.: 7429-90-5 / 7440-50-8
Max. dia. of flat disc sputter target: 18"
Typical lead time of Al/Cu sputtering target: 3 weeks
Regular Dimensions and Price of Aluminum Copper (Al/Cu) Sputtering Target
|
Product Name |
Reference Price |
|
|
2"dia
x 1/8"t Aluminum Copper sputtering target |
$555.5 | Add to Chart |
|
3"dia
x 1/8"t Aluminum Copper sputtering target |
$695 |
Add to Chart |
|
2"dia
x 1/8"t Al/Cu sputtering target with In bonding to Cu bck plt |
$636 |
Add to Chart |
|
3"dia
x 1/8"t Al/Cu sputtering target with In bonding to Cu bck plt |
$830 | Add to Chart |
About Our Sputtering Target
QS Advanced Materials Inc is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Alloys sputter targets
Sputtering Aluminum Copper
Sputtering technique are frequently used to create a thin film of Aluminum Copper . The Al/Cu target material is placed on the electrode in the sputtering chamber. Heavy ion particle or laser are frequently used to ejecting coating material from the target, made by Aluminum Copper in this case, to create a thin film of Al/Cu on the surface of the substrate.
Aluminum Copper Sputtering Target Packaging
QS Advanced Materials Incs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA
Related Product