Aluminum Boride (AlB) Sputtering Targets

Aluminum Boride (AlB) sputtering target specifications

Formula: AlB

CAS No.: 12041-50-8

Max. dia. of flat sputter target: 8"

Typical lead time of AlB sputtering target: 4 weeks

Regular Dimensions and Price of Aluminum Boride (AlB) Sputtering Target

Product Name	Reference Price
2"dia x 1/8"t Aluminum Boride sputtering target	$634	Add to Chart
3"dia x 1/8"t Aluminum Boride sputtering target	$956	Add to Chart
2"dia x 1/8"t AlB sputtering target with In bonding to Cu bck plt	$714	Add to Chart
3"dia x 1/8"t AlB sputtering target with In bonding to Cu bck plt	$1,091	Add to Chart

About Our Sputtering Target

 QS Advanced Materials Inc is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our sputter target material and other customized product. 

Sputtering Aluminum Boride

Sputtering technique are frequently used to create a thin film of Aluminum Boride. The AlB target material is placed on the electrode in the sputtering chamber. Heavy ion particle or laser are frequently used to ejecting coating material from the target, made by Aluminum Boride in this case, to create a thin film of AlB on the surface of the substrate.

Aluminum Boride Sputtering Target Packaging

QS Advanced Materials Incs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA

Related Product

Electrolyte Iron (Fe) / High purity iron

High purity alumina (Al2O3) particles

High purity alumina (Al2O3) Grit