Aluminum Boride (AlB) Sputtering Targets
Composition: Aluminum Boride (AlB)
Catalog No.DPBO13ST
Purity:99.9%Please click 
for discount and other size
- Product Details
Aluminum Boride (AlB) sputtering target specifications
Formula: AlB
CAS No.: 12041-50-8
Max. dia. of flat disc sputter target: 8"
Typical lead time of AlB sputtering target: 4 weeks
Regular Dimensions and Price of Aluminum Boride (AlB) Sputtering Target
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Product Name |
Reference Price |
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2"dia
x 1/8"t Aluminum Boride sputtering target |
$634 | Add to Chart |
|
3"dia
x 1/8"t Aluminum Boride sputtering target |
$956 |
Add to Chart |
|
2"dia
x 1/8"t AlB sputtering target with In bonding to Cu bck plt |
$714 |
Add to Chart |
|
3"dia
x 1/8"t AlB sputtering target with In bonding to Cu bck plt |
$1,091 | Add to Chart |
About Our Sputtering Target
QS Advanced Materials Inc is a professional supplier of custom manufacturered R&D consumptions. Our equipment setup are flexible to meet various demands from wide range of customers for flat disc sputter targets. We are supporting US national labs and worldwide univeristies and researching facilities with our target material and other customized product. Please check here for the list of our other Borides sputter targets
Sputtering Aluminum Boride
Sputtering technique are frequently used to create a thin film of Aluminum Boride. The AlB target material is placed on the electrode in the sputtering chamber. Heavy ion particle or laser are frequently used to ejecting coating material from the target, made by Aluminum Boride in this case, to create a thin film of AlB on the surface of the substrate.
Aluminum Boride Sputtering Target Packaging
QS Advanced Materials Incs sputter targets are vacuum sealed in plastic bags for shipping. We also use heavy foam to protect it. Common documents together with the sputter targets are packing list and analytical report e.g. COA
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