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- Copper Aluminum Composite Bimetal Material
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DyScO3 Sputter Target
Composition: DyScO3
Catalog No.DPMO209ST
Purity:>99.5%Please click
for discount and other size
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ErMnO3 Sputter Target
Composition: ErMnO3
Catalog No.DPMO210ST
Purity:>99.5%Please click
for discount and other size
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GdFeO3 Sputter Target
Composition: GdFeO3
Catalog No.DPMO211ST
Purity:>99.5%
Please click for discount and other size
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HoMnO3 Sputter Target
Composition: HoMnO3
Catalog No.DPMO212ST
Purity:>99.5%Please click
for discount and other size
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PbZr1-XTiXO3 Sputter Target
Composition: PbZr1-XTiXO3
Catalog No.DPMO214ST
Purity:>99.5%Please click
for discount and other size
Click here for the specifications of PbZr1-XTiXO3 Sputter Target
Click here for the SDS document of PbZr1-XTiXO3 Sputter Target
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Sr3Al2O6 Sputter Target
Composition:Sr3Al2O6 (SAO)
Catalog No.:DPMO216ST
Purity:>99.5%
Please click for discount and other size
Click here for the specifications of Sr3Al2O6 Sputter Target
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SrCoO2.5 Sputter Target
Composition:SrCoO2.5
Catalog No.:DPMO217ST
Purity:>99.5%
Please click for discount and other size
Click here for the specifications of SrCoO2.5 Sputter Target
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SrCuO2 Sputter Target
Composition:SrCuO2
Catalog No.:DPMO218ST
Purity:>99.5%
Please click for discount and other size
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SrInO3 Sputter Target
Composition:SrInO3
Catalog No.:DPMO219ST
Purity:>99.5%
Please click for discount and other size
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SrMnO3 Sputter Target
Composition:SrMnO3
Catalog No.:DPMO221ST
Purity:>99.5%
Please click for discount and other size
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Copper clad aluminum plate
Catalog No.:CCA-plate
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper clad aluminum strip
Catalog No.:CCA-strip
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum composite material
Catalog No.:CCA
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic foil
Catalog No.:CCA-foil
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic plate
Catalog No.:CCA-plate
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic strip
Catalog No.:CCA-strip
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic busbar
Catalog No.:CCA-busbar
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic connector
Catalog No.:
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Copper aluminum bimetallic LiB terminal
Catalog No.:CCA-terminal
Copper Layer: 10~30%
Typical Material: C11000 copper+ 1060 aluminum
Copper Aluminum bond strength: >40MPa
Thickness: 0.3mm-20mm
Width: 10~950mm
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Standard MBE Crucible (PBN 10-22)
Composition:Pyrolytic Boron Nitride (PBN)
Catalog No.:PBN 10-22/415-00-006
Purity:99.99% Chemical content of QSAM PBN crucible
Pysical properties of QSAM PBN crucible